5. Water guide laser cutting
The water-guiding laser focuses the laser light and guides it into the miniature water column. The diameter of the water column varies with the nozzle aperture, and there are various specifications ranging from 100 to 30 m. Using the principle of total reflection at the interface between the water column and the air, the laser beam is introduced into the water column and propagates along the forward direction of the water column.
The water column can be processed within a stable range, and the long effective working distance is especially suitable for cutting thick materials. In the traditional laser cutting process, the accumulation and conduction of energy is the main cause of thermal damage on both sides of the cutting line, while the water-guided laser will not quickly absorb the remaining heat of each pulse and accumulate on the workpiece under the action of the water column, so Cutting lanes are clean.
Based on these advantages, it is a good choice to use water-guided laser cutting silicon carbide in theory, but the technology is difficult, the maturity of related equipment is not high, and the production of fragile nozzles is difficult, and the fine water column cannot be accurately and stably controlled, and the splash Droplets of water would ablate away the chips, so the process is currently not suitable for silicon carbide wafer fabrication.
This paper analyzes several current cutting process methods for silicon carbide wafers, and compares their advantages, disadvantages and feasibility in combination with process tests and data. Among them, the processing method combining laser stealth cutting and slitting has high processing efficiency and the process effect meets the production needs. It is an ideal processing method for silicon carbide wafers.
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