Major breakthrough! China's laser invisible wafer cutting technology achieves 50nm resolution, leading the world

On September 29, the Great Wall of China announced that it had completed the technical iteration of semiconductor laser invisible wafer cutting equipment, and improved the resolution from 100nm to 50nm, reaching the highest accuracy in the industry. This is really a great news! With the hard work and efforts of various scientific research institutes and enterprises in the industry, breakthroughs have been made in key technologies. This time, China's laser invisible wafer cutting technology has achieved the leading position in the world, which is really gratifying.

The manufacturing of chips is very complex, involving many links and equipment, and the lithography machine that everyone is familiar with and concerned about is just one of them. The lithography machine is responsible for carving chips on the wafer, and it also needs many steps such as testing, cutting, packaging, etc. to form a chip.

In the packaging process, China has become the world's top level. Cutting, as an indispensable part of the chip manufacturing process, is responsible for cutting the chips on the wafer one by one. The quality of the cutting process also directly determines the yield of the chip.

At present, the mainstream chip cutting technology is laser invisible cutting. This technology can focus a small power laser on a spot with a diameter of only 100 nanometers to form a huge local energy, and then cut the wafer, so as to avoid the impact of high-power laser on the chip.

Wafer chips have been monopolized by European and American manufacturers in terms of cutting equipment. However, in May 2020, the Great Wall of China developed China's first semiconductor laser invisible wafer cutting machine, which filled the gap in this field at one stroke, successfully broke the foreign monopoly, and the key technical performance parameters reached the world's leading level.

By 2021, it will only take more than one year to complete the technical iteration, and the resolution will be improved from 100nm to 50nm, twice higher than similar equipment in the United States, reaching the highest accuracy in the industry.

The laser wafer invisible cutting equipment after iteration and upgrading can freely control the depth of the laser focus, the length of the focus point, and the horizontal spacing between the two focuses. By using special materials, special structural design, and special motion platform, it can maintain high stability and high-precision cutting under the high-speed movement of 500mm/S. The laser focus is only 0.5um, and the cutting trace is more delicate, It can avoid damage to the material surface and greatly improve the quality, efficiency and efficiency of chip manufacturing.

This laser wafer invisible cutting device can be widely used in high-energy integrated circuit products, including CPU manufacturing, image processing IC, automotive electronics, sensors, memory and other fields. It has played a positive role in promoting China's high-end domestic semiconductor supply chain, and is of great practical significance.